SILPAKORN UNIVERSITY SCIENCE AND TECHNOLOGY JOURNAL, Vol 5 (No 2) Special issue from OR-Net 2011 Conference

Flexible Printed Circuit Process Improvement via Interchangeable Linear Constrained Response Surface Optimisation Models

Pichpimon Kanchanasuttisang, Pongchanun Luangpaiboon

Industrial Statistics and Operational Research Unit (ISO-RU), Department of Industrial Engineering, Faculty of Engineering, Thammasat University, Pathumthani, Thailand

Industrial Statistics and Operational Research Unit (ISO-RU), Department of Industrial Engineering, Faculty of Engineering, Thammasat University, Pathumthani, Thailand


Abstract


This paper presents a collection of experimental design and mathematical programming techniques for quality improvement in automotive electronic parts. The quality performance of interest is measured via the relationship of the etched rate of acid solution and circuit width, one of the key failure and break down to LED of lighting vehicles. With lower levels from monitoring the product quality the manufacturer has spent a lot of cost and time for product verification procedures. This brings the production with higher levels of waste and lead time. To validate on processing and to sustain finished goods with the permanent prevention, the precisely etched condition should be optimised. The proper factorial experiments, multiple regression and mathematical programming approaches are applied to investigate the preferable levels of significant process variables in order to improve the quality of etched rate. The interchangeable constrained response surface optimisation models provide the new operating conditions. The experimental results in each part with less than twenty five lines showed that the first model decreases the bottom circuit width deviation from 0.0026 to 0.0024 and the latter model decreases the etching rate from 2.033 to 1.124.

Keywords : Flexible Printed Circuit Process; Circuit Width; Etched Rate; Response Surface Methodology; Multiple Regression; Steepest Descent

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